Major companies have patented variety of solutions to protect their own AiP structures and manufacturing processes. What are the white spaces left? Is the freedom to operate hampered?

SOPHIA ANTIPOLIS, France – June 21, 2021 | Smaller, denser, cost efficient and high performances. These are some of the challenges that the RF industry must address to fully exploit 5G. To answer these criteria, all the RF industry has to develop new technologies from the material to the integrator. Packaging makers are also impacted[…]

The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents

SOPHIA ANTIPOLIS, France – January 28, 2021 | The last decade has seen EV/HEV applications driving packaging innovation in power electronics and creating new equations to solve for module makers, in particular further downsizing, higher power density, higher reliability and lower cost/higher manufacturability. On top of that, automotive OEMs are asking for highly standardized power[…]

The last 2 years marked a turning point for RF GaN patenting activity now driven by China and moving on technical issues further down the value chain

SOPHIA ANTIPOLIS, France – November 6, 2020 | The radio frequency (RF) GaN market is experiencing impressive growth, mainly driven by telecom and military applications. Yole Développement predicts a GaN RF market increase from $740 million in 2019 to more than $2 billion in 2025, with a CAGR of 12%. According to market analysts, both[…]