Antenna in Package Patent Landscape 2021

Major companies have patented variety of solutions to protect their own AiP structures and manufacturing processes. What are the white spaces left? Is the freedom to operate hampered ? Publication June 2021 Download Flyer  Download Sample Report’s Key Features • PDF with > 80 slides • Excel file > 660 patent families + hyperlink to updated[…]

Hybrid Bonding Patent Landscape 2019

Who has the ability to hamper the development of products using hybrid bonding processes?   Publication November 2019 Download Flyer  Download Sample Report’s Key Features • PDF with > 80 slides • Excel file > 1,000 patents • IP trends, including time-evolution of published patents, countries of patent filings, etc. • Ranking of main patent assignees[…]

Patent Licensing Companies in the Semiconductor Market 2017

The semiconductor industry has all the attributes that appeal to patent licensing companies (PLCs): Are you in their sights? Publication February 2017 Download Flyer  Download Sample Report’s Key Features • PDF > 100 slides • Ranking of PLCs according to their recent patent acquisitions in the semiconductor field • Dynamics of patent acquisitions and patented technology[…]

Fan-Out Wafer Level Packaging Patent Landscape 2016

With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position. Publication November 2016 Download Flyer  Download Sample Report’s Key Features • PDF > 200 slides • Excel file (3,100+[…]