Featured image of the article TFSAW Patent War: Murata Has Built the Wall, China Is Racing for Position.

TFSAW Patent War: Murata Has Built the Wall, China Is Racing for Position

A patent-landscape insight on Thin-Film Surface Acoustic Wave filters SOPHIA ANTIPOLIS, France, June 23, 2026 │ Thin-Film Surface Acoustic Wave (TFSAW) technology is moving from a specialist engineering topic to one of the most closely watched patent arenas in RF front-end filters. According to Knowmade’s RF Acoustic Wave Filters Patent Landscape Analysis 2026, TFSAW has[…]

Featured image of the article KnowMade Releases Its 2025 RF Front-End Patent Monitoring Summary: Insights into Competition and Technology Trends.

KnowMade Releases Its 2025 RF Front-End Patent Monitoring Summary: Insights into Competition and Technology Trends

SOPHIA ANTIPOLIS, France – April 2, 2026 │ The RF front-end industry continues to evolve at a rapid pace, driven by the increasing complexity of wireless communication systems and the transition toward highly integrated architectures. In this context, intellectual property (IP) has become a critical indicator of technological leadership, competitive positioning, and future market direction.[…]

Featured image of the article How TSMC Is Redefining Thermal Management for 2.5D/3D Advanced Packaging for HPC and AI.

How TSMC Is Redefining Thermal Management for 2.5D/3D Advanced Packaging for HPC and AI

SOPHIA ANTIPOLIS, France – January 27, 2026 │ As semiconductor packaging evolved toward 2.5D, 3D stacking, and heterogeneous integration, thermal management has emerged as one of the most critical limiting factors for performance, reliability, and manufacturability. Power densities in high-performance computing (HPC) and artificial intelligence (AI) chips continue to rise, while package sizes increase and[…]

Featured image of the article Murata’s Patent Litigation Against Maxscend: Interpreting the TF-SAW Battle from Shanghai, Seoul, to Munich.

Murata’s Patent Litigation Against Maxscend: Interpreting the TF-SAW Battle from Shanghai, Seoul, to Munich

SOPHIA ANTIPOLIS, France, January 5, 2025 │ The patent litigation initiated by Murata Manufacturing against Maxscend Microelectronics in 2025 is not a routine infringement dispute limited to a single jurisdiction or isolated invention. Instead, it represents a structurally significant confrontation over thin-film surface acoustic wave (TF-SAW) technology, spanning China, South Korea, and Germany, and touching[…]