…it is crucial to enable high-temperature operation in SiC modules (200-300°C), e.g. through new packaging materials, as well as high-speed operation, by minimizing parasitic inductance. As a result, the last decade was marked by extensive innovation in power module design and packaging, leading to a very high volume of patent…
…Omega Semiconductor, Coorstek, General Electric, Hiwafer, SUSTech, Foshan Tk Semiconductor, University of California, VisIC Technologies, CNRS, Dowa Electronics Materials, Powdec, SNU, ITRI, Ku Leuven, Qromis, Sanan IC, SETi, Vishay, A*STAR, Cambridge Electronics, Dialog Semiconductor, Dynax Semiconductor, Ganpower, Globalfoundries, Huawei, Simgui, University of Florida, Air Water, IQE, M-MOS Semiconductor, University of…
…category of materials belongs to the BOSE consortium including Litec/Merck, LWB, Toyoda Gosei. The Nitride / Oxynitride sections are dominated by Japanese players. Others big companies also own some IP on nitride compositions. Beside, other assignees on the list mention the use of Nitrides with LEDs but, for the most,…
…materials and substrates in the semiconductor field using our proven patent landscape analysis method. GaN-on-Si is entering production: What is the patent situation? GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for…