Featured image of the webinar on advanced packaging.

Webinar – Advanced Semiconductor Packaging: leading patent owners and new entrants

SOPHIA ANTIPOLIS, France – May 30, 2024 │Dr. Pauline Calka shared her expertise on Advanced Semiconductor Packaging, focusing on leading patent owners and new entrants in fan-out WLP, interposer, bridge, and hybrid bonding technologies. All the materials are gathered below. Webinar video recording About the subject Since 2016, KnowMade has been researching and monitoring the[…]