Featured image of the article Intel’s Expanding IP Portfolio in Co-Packaged Optics.

Intel’s Expanding IP Portfolio in Co-Packaged Optics

SOPHIA ANTIPOLIS, France – November 13, 2025 │ As demand for data-intensive computing continues to rise, Intel has developed an extensive suite of patents addressing the integration of photonic and electronic systems at the package level. These inventions collectively illustrate the transition from traditional electrical interconnects toward optical input/output (I/O) architectures that enable higher bandwidth,[…]

Featured image of the article Skyworks and Qorvo Merge: Building a Global RF Front-End IP Powerhouse.

Skyworks and Qorvo Merge: Building a Global RF Front-End IP Powerhouse

SOPHIA ANTIPOLIS, France, November 03, 2025 │ Skyworks Solutions, Inc. and Qorvo, Inc. announced on October 28, 2025, a definitive agreement to merge in an all-cash and stock transaction valued at approximately $22 billion, creating a new U.S.-based leader in high-performance RF and mixed-signal solutions. The combined company is expected to generate about $7.7 billion[…]

Featured image of the article Intel-Mobileye Leading th Imaging Radar IP Landscape within ADAS Platform Companies.

Intel-Mobileye Leading the Imaging Radar IP Landscape Within ADAS Platform Companies

SOPHIA ANTIPOLIS, France, September 5, 2025 │ KnowMade has released its new study, Imaging Radar for Autonomous Systems – Patent Landscape Analysis 2025, a comprehensive report that analyzes one of the most competitive intellectual property (IP) battlefields in autonomy. The study identifies more than 22,200 patent applications, grouped into over 10,600 patent families, including about[…]

Featured image of the article YMTC’s Hybrid Bonding Patents: A Key Competitive Factor for Memory Chipmakers.

YMTC’s Hybrid Bonding Patents: A Key Competitive Factor for Memory Chipmakers

SOPHIA ANTIPOLIS, France – June 19, 2025 │ Hybrid bonding is a technique that connects two semiconductor chips by directly bonding copper interconnects to copper and insulating materials to insulating materials. Unlike conventional chip-stacking methods that rely on solder balls or bumps, hybrid bonding enables thinner packaging while improving both electrical and thermal performance. Over[…]