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Packaging news

How is 3D TSV a reality?

Posted on January 12, 2017November 29, 2022 by knowmade

SOPHIA ANTIPOLIS, France – January 12, 2017| 3D is becoming a key technology platform for increase integration, either for heterogeneous integration (like for MEMS and CMOS image sensor) or for increasing the performances (like for DRAM and IC partitioning). When a company has started to adopt TSV, there is no turning back. In 2016 again,[…]

Posted in Memory news, Packaging news, Semiconductor news

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