Packaging news Archives

How is 3D TSV a reality?

Posted on January 12, 2017September 21, 2022 by knowmade

SOPHIA ANTIPOLIS, France – January 12, 2017| 3D is becoming a key technology platform for increase integration, either for heterogeneous integration (like for MEMS and CMOS image sensor) or for increasing the performances (like for DRAM and IC partitioning). When a company has started to adopt TSV, there is no turning back. In 2016 again,[…]

Fan-out: the most dynamic IP landscape in advanced packaging

Posted on December 1, 2016September 21, 2022 by knowmade

In the fast-growing Fan-Out market showing 80% increase between 2015 and 2017 , it is today essential to deeply understand the patent strategies of the key players. The Technology Intelligence & IP Strategy Company, KnowMade has thoroughly investigated the Fan-Out packaging patent landscape and releases today the new patent landscape analysis titled Fan-Out Wafer Level Packaging.[…]