SOPHIA ANTIPOLIS, France – November 15, 2024 │Dr. Pauline Calka, from our Semiconductor team, presented a poster during SEMICON Europa 2024, providing information on Advanced packaging from a patent perspective. It is now available online.
Poster
About the subject
Advanced packaging techniques have emerged as crucial solutions to meet the needs of the semiconductor industry. These new approaches allow for the integration of multiple dies into a single package, with the possibility of combining mature and advanced nodes. The roadmap is challenging and the supply chain is becoming increasingly competitive. In this context, it is crucial to monitor the patent activity and the intellectual property (IP) strategies of key players. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. Semiconductor packaging was primarily performed by OSATs such as ASE/SPIL, Amkor, JCET, and others and they continue to play an important role in this field. TSMC, Samsung and Intel have been developing innovative 2.5D/3D packaging solutions such as silicon interposer and embedded bridge. By offering advanced back-end solutions and by using front-end capabilities, these companies are poised to influence future technology and intellectual property developments in this area. The licensing company Adeia/Xperi has a strong IP portfolio on hybrid bonding but other players have been increasing their R&D efforts on this topic. Besides, while historical players have expanded their patent portfolios, new entrants have recently joined the patent landscape with a blooming IP activity. In this presentation we aim to unveil the dynamics of the IP landscape related to advanced semiconductor packaging. We will provide an overview of the patenting activity trends in this complex technology field by looking at leading patent owners and new entrants in different segments such as fan-out WLP, interposers, embedded bridge interconnects or die, and hybrid bonding. We will dive into players’ IP timeline and geographic coverage strategy. Finally, players’ IP leadership related to these advanced packaging segments will be disclosed.
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About the author
Pauline Calka, PhD. works for KnowMade as a patent analyst in the fields of semiconductor manufacturing and advanced packaging. She holds a PhD in Memory from the University of Grenoble Alpes (France), in partnership with the CEA-Leti (France). After an Alexander von Humboldt Postdoc fellowship position at the Technical University of Berlin (Germany) and the Leibniz Institute for High Performance Microelectronics on ReRAM development, Pauline worked five years at ASM International (Belgium) as Senior Process Engineer on thin film development for logic, memory and MEMS, and two years at CEA-Leti as Integration Engineer on imaging CMOS sensors.
About KnowMade
KnowMade is a technology intelligence and IP strategy consulting company specialized in analyzing patents and scientific publications. The company helps innovative companies, investors, and R&D organizations to understand competitive landscape, follow technological evolutions, reduce uncertainties, and identify opportunities and risks in terms of technology and intellectual property.
KnowMade’s analysts combine their strong technology expertise and in-depth knowledge of patents with powerful analytics tools and methodologies to turn patent information and scientific literature into actionable insights, providing high added value reports for decision makers working in R&D, innovation strategy, intellectual property, and marketing. Our experts provide prior art search, patent landscape analysis, freedom-to-operate analysis, IP due diligence, and monitoring services.
KnowMade has a solid expertise in Compound Semiconductors, Power Electronics, Batteries, RF Technologies & Wireless Communications, Solid-State Lighting & Display, Photonics, Memories, MEMS & Sensors, Semiconductor Packaging, Medical Devices, Medical Imaging, Microfluidics, Biotechnology, Pharmaceutics, and Agri-Food.