SOPHIA ANTIPOLIS, France – January 21, 2026 │ KnowMade, a leading provider of patent analysis services, is proud to announce the release of its latest report, Co-Packaged Optics and Optical Interconnects Patent Landscape Analysis. This comprehensive report provides a detailed examination of the competitive landscape of the co-packaged optics (CPO) and optical interconnects (I/O) technology from a patent perspective, offering critical insights for stakeholders and decision-makers.
A Technological Trend To Watch
Co-packaged optics (CPO) and optical interconnects (I/O) technologies are emerging as key enablers for next-generation high-performance computing (HPC) and data center architectures. As electrical interconnects approach their fundamental limits, integrating optical interfaces closer to switching and compute silicon offers significant gains in bandwidth density, power efficiency, and scalability. This report analyzes the intellectual property (IP) landscape surrounding CPO and optical I/O solutions, highlighting key patent holders, technological trends, competitive dynamics, and innovation pathways shaping the future of advanced semiconductor packaging.
Key Highlights Of The Report
- Patent Analysis: The report provides an evaluation of the global patent landscape, encompassing patent filing trends, geographical distribution, and legal status.
- Competitive Intelligence: Identification and profiling of major IP players, including both established patent assignees and emerging patent applicants, revealing their R&D focus and strategic positioning.
- Technological Innovations: Insights into the latest technological advancements and innovative approaches, highlighting ongoing R&D efforts and potential future directions.
- Strategic Guidance: Actionable IP intelligence for industrials, enabling informed strategic decisions related to R&D investments, patent portfolio management, and competitive positioning.
The Co-Packaged Optics and Optical Interconnects Patent Landscape report is an essential resource for semiconductor companies, IP professionals, investors, and technology developers aiming to gain a competitive edge in the advanced packaging domain.
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About the author
Pauline Calka, PhD. works for KnowMade as a patent analyst in the fields of semiconductor manufacturing and advanced packaging. She holds a PhD in Memory from the University of Grenoble Alpes (France), in partnership with the CEA-Leti (France). After an Alexander von Humboldt Postdoc fellowship position at the Technical University of Berlin (Germany) and the Leibniz Institute for High Performance Microelectronics on ReRAM development, Pauline worked five years at ASM International (Belgium) as Senior Process Engineer on thin film development for logic, memory and MEMS, and two years at CEA-Leti as Integration Engineer on imaging CMOS sensors.
About KnowMade
KnowMade is a technology intelligence and IP strategy firm specializing in the analysis of patents and scientific publications. We assist innovative companies, investors, and research organizations in understanding the competitive landscape, anticipating technological trends, identifying opportunities and risks, improving their R&D, and shaping effective IP strategies.
KnowMade’s analysts combine their strong technology expertise and in-depth knowledge of patents with powerful analytics tools and methodologies to transform patent and scientific data into actionable insights to support decision-making in R&D, innovation, investment, and intellectual property.
KnowMade has solid expertise in Semiconductors and Packaging, Power Electronics, Batteries and Energy Management, RF and Wireless Communications, Photonics, MEMS, Sensing and Imaging, Medical Devices, Biotechnology, Pharmaceuticals, and Agri-Food.