SOPHIA ANTIPOLIS, France – November 13, 2025 │ As demand for data-intensive computing continues to rise, Intel has developed an extensive suite of patents addressing the integration of photonic and electronic systems at the package level. These inventions collectively illustrate the transition from traditional electrical interconnects toward optical input/output (I/O) architectures that enable higher bandwidth,[…]
SOPHIA ANTIPOLIS, France – June 19, 2025 │ Hybrid bonding is a technique that connects two semiconductor chips by directly bonding copper interconnects to copper and insulating materials to insulating materials. Unlike conventional chip-stacking methods that rely on solder balls or bumps, hybrid bonding enables thinner packaging while improving both electrical and thermal performance. Over[…]
SOPHIA ANTIPOLIS, France – April 07, 2025 │ Optical interposers are a crucial technology for advanced semiconductor packaging and co-packaged optics, driving the rapid growth of artificial intelligence (AI) and high-performance computing (HPC) applications by enabling data transmission through light rather than traditional electrical signaling. Several companies are actively developing optical interposers and related photonics.[…]
SOPHIA ANTIPOLIS, France – January 9, 2025 │ Advanced semiconductor packaging is a rapidly evolving field where multiple technologies are being developed simultaneously. The integration of glass into substrates and interposers within semiconductor packages has the potential to accelerate the development of emerging technologies targeting applications such as artificial intelligence (AI), high-performance computing (HPC) and[…]