SOPHIA ANTIPOLIS, France – January 27, 2026 │ As semiconductor packaging evolved toward 2.5D, 3D stacking, and heterogeneous integration, thermal management has emerged as one of the most critical limiting factors for performance, reliability, and manufacturability. Power densities in high-performance computing (HPC) and artificial intelligence (AI) chips continue to rise, while package sizes increase and[…]
SOPHIA ANTIPOLIS, France, January 5, 2025 │ The patent litigation initiated by Murata Manufacturing against Maxscend Microelectronics in 2025 is not a routine infringement dispute limited to a single jurisdiction or isolated invention. Instead, it represents a structurally significant confrontation over thin-film surface acoustic wave (TF-SAW) technology, spanning China, South Korea, and Germany, and touching[…]
SOPHIA ANTIPOLIS, France, November 25, 2025 │ According to KnowMade’s upcoming LiDAR for Automotive (ADAS and Robotic Vehicles) Patent Landscape Analysis 2025, the global patent landscape for automotive LiDAR has reached a new level of intensity. As of October 2025, the field contains more than 36,000 patent families and over 62,000 individual patents. Since 2020,[…]
SOPHIA ANTIPOLIS, France – November 13, 2025 │ As demand for data-intensive computing continues to rise, Intel has developed an extensive suite of patents addressing the integration of photonic and electronic systems at the package level. These inventions collectively illustrate the transition from traditional electrical interconnects toward optical input/output (I/O) architectures that enable higher bandwidth,[…]