SOPHIA ANTIPOLIS, France – June 19, 2025 │ Hybrid bonding is a technique that connects two semiconductor chips by directly bonding copper interconnects to copper and insulating materials to insulating materials. Unlike conventional chip-stacking methods that rely on solder balls or bumps, hybrid bonding enables thinner packaging while improving both electrical and thermal performance. Over[…]
SOPHIA ANTIPOLIS, France – Juin 12, 2025 │ Autonomous driving is no longer just a matter of adding more sensors. It now demands systems that can truly interpret and respond to their environment. Imaging radar has emerged as one of the core technologies enabling this transition. Unlike conventional millimeter-wave radar, imaging radar is not simply[…]
SOPHIA ANTIPOLIS, France – 27 May 2025 │ Previous patent analyses conducted in 2022 have confirmed the emergence of a domestic SiC industry in South Korea. Driven by government-sponsored national programs, South Korean material conglomerates SK group (including SKC, SK Siltron, SK Inc., SK Innovation), Posco and LG group (including LG Chem, LG Electronics and[…]
SOPHIA ANTIPOLIS, France – April 14, 2025 │ Subtle yet transformative, reconfigurable intelligent surfaces (RIS) are quietly rewriting the rules of radio frequency (RF) communication. As we stand at the threshold of the 6G era, RIS is no longer just a promising concept in academic papers, it has become an intellectual property (IP) battleground where[…]