Search Results for: Electronics

RF Acoustic Wave Filters Patent Landscape 2019

…THALES, ADVANCED SAW PRODUCTS, MOTOROLA, WISOL, UBE INDUSTRIES, MITSUBISHI ELECTRIC, SUMITOMO ELECTRIC INDUSTRIES, LG ELECTRONICS, CHINA ELECTRONICS TECHNOLOGY, ALPS ELECTRIC, TIANJIN UNIVERSITY, TOKO, HANGZHOU SAPPLAND MICROELECTRONICS TECHNOLOGY, ZENITH RADIO, TEXAS INSTRUMENTS, SONY, INTELLECTUAL VENTURES HOLDING, RESONANT, STMICROELECTRONICS, INSTITUTE OF ACOUSTICS CHINESE ACADEMY OF SCIENCES, MITSUBISHI MATERIALS, CEA, SHOULDER ELECTRONICS, and…

Antenna for 5G and 5G-related Applications Patent Landscape 2019

…COMBA TELECOM SYSTEMS, UNIVERSITY OF ELECTRONIC SCIENCE & TECHNOLOGY OF CHINA, KUANG CHI INSTITUTE OF ADVANCED TECHNOLOGY, SHANGHAI AMPHENOL AIRWAVE COMMUNICATION ELECTRONICS, MURATA MANUFACTURING, QUALCOMM, KUNSHAN RUIXIANG XUNTONG COMMUNICATION TECHNOLOGY CO, SONY, ELECTRONICS & TELECOMMUNICATIONS RESEARCH INSTITUTE, ZTE, CHINA JILIANG UNIVERSITY, HUIZHOU SPEED WIRELESS TECHNOLOGY, VIVO MOBILE COMMUNICATION, and more….

Fan-Out Wafer Level Packaging Patent Landscape 2016

…Technology, Murata Electronics, NCAP, Nepes, Niko Semiconductor, Nippon Electric Glass, Nitto Denko, North Star Innovations (WiLAN), NXP/Freescale, Nytell Software, Oerlikon, PacTech Packaging Technologies, Philips, Polaris Innovations (WiLAN), Powertech Technology, Princo Middle East FZE, Qimonda, Qualcomm, Renesas Electronics, Samsung Electronics, Samsung Electro Mechanics, Semiconductor Components Industries, Seoul National University (SNU), Sharp,…

TSV Stacked Memory Patent Landscape 2016

…ELM 3DS and microelectronics giants (Samsung Electronics, SK Hynix and Micron Technology). The TSV 3D Memory market to show 43% CAGR to 2020 according to Yole Development, with almost 200K units wafers in 2016. Samsung started 3DS DDR4 DRAM production in 2014, HBM2 4Gb at the beginning of the year…