Hybrid Bonding Patent Landscape 2019
…INTEL, SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATION, SHANGHAI IC R&D CENTER, XMC, OMNIVISION TECHNOLOGIES, IMEC, MONOLITHIC 3D, NANYA TECHNOLOGY, KATHOLIEKE UNIVERSITEIT LEUVEN, GLOBALFOUNDRIES, AMERICAN BUSINESS GRID IC TECHNOLOGY, ON SEMICONDUCTOR, QUALCOMM, NCAP, LEXVU OPTO MICROELECTRONICS TECHNOLOGY, INTELLECTUAL VENTURES, MAGNACHIP SEMICONDUCTOR, IBM, ATRI, INSTITUTE OF MICROELECTRONICS CHINESE ACADEMY OF SCIENCES, and more….