Packaging patent landscape

Fan-Out Wafer Level Packaging Patent Landscape 2016

With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position. Publication November 2016 Download Flyer Download Sample Report’s Key Features PDF > 200 slides Excel file (3,100+ patents)[…]

TSV Stacked Memory Patent Landscape 2016

An emerging market with leading industrials and first patent litigations; Who owns what ? Publication September 2016 Download Flyer Download Sample Report’s Key Features PDF > 140 slides Excel file (1,500+ patents) IP trends including time evolution of patent publications and patent filings countries Current legal status of patents (granted, pending application, abandoned, expired) Main patent[…]