Antenna in Package Patent Landscape 2021

Major companies have patented variety of solutions to protect their own AiP structures and manufacturing processes. What are the white spaces left? Is the freedom to operate hampered ? Publication June 2021 Download Flyer  Download Sample Report’s Key Features PDF with > 80 slides Excel file > 660 patent families + hyperlink to updated online database[…]

Hybrid Bonding Patent Landscape 2019

Who has the ability to hamper the development of products using hybrid bonding processes?   Publication November 2019 Download Flyer Download Sample Report’s Key Features PDF with > 80 slides Excel file > 1,000 patents IP trends, including time-evolution of published patents, countries of patent filings, etc. Ranking of main patent assignees Key players’ IP position[…]

Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017

What are the main patented features of Knowles’ MEMS Microphones in the iPhone 7 Plus? Publication April 2017 Download Flyer Download Sample Report’s Key Features PDF >100 slides Essential IP analysis of Knowles’ patent portfolio related to the MEMS Microphones of Apple iPhone 7 Plus including: Time evolution of patent publications and countries of patent filings[…]

Fan-Out Wafer Level Packaging Patent Landscape 2016

With Apple and TSMC changing the game, 2016 is a turning point for the Fan-Out market. The number of enforceable patents is increasing worldwide, with several companies already standing out by virtue of their strong IP position. Publication November 2016 Download Flyer Download Sample Report’s Key Features PDF > 200 slides Excel file (3,100+ patents) IP[…]