GaN Devices for Power Electronics Patent Investigation

Electronics, Dowa Electronics Materials, Efficient Power Conversion (EPC), EpiGaN, ExaGaN, Fairchild Semiconductor, Freescale, Fuji Electric, Fujitsu, Furukawa Electric, GaN Systems, General Electric, Genesic Semiconductor, Hitachi, HRL Laboratories, Infineon, International Rectifier,…

RF GaN Patent Landscape

…Chuangwei Electronics. Other noticeable new entrants are Taiwan’s TSMC and Wavetek Microelectronics, Korea’s Wavice and Gigalane, Japan’s Advantest, and America’s MACOM and ON Semiconductor. In the report we detail both…

Patent Licensing Companies in the Semiconductor Market

…PolyIC, Power Integrations, Powerchip Technology, Promos Technologies, Qorvo, Qualcomm, Quarkstar, Raytheon, Renesas Electronics, Ricoh, Robert Bosch, Rohm, Samsung Electronics, Sandisk, Seagate Technology, Seiko Epson, Semiconductor Energy Laboratory, Semiconductor Manufacturing International,…

Antenna for 5G and 5G-related Applications Patent Landscape

…KUANG CHI INSTITUTE OF ADVANCED TECHNOLOGY, SHANGHAI AMPHENOL AIRWAVE COMMUNICATION ELECTRONICS, MURATA MANUFACTURING, QUALCOMM, KUNSHAN RUIXIANG XUNTONG COMMUNICATION TECHNOLOGY CO, SONY, ELECTRONICS & TELECOMMUNICATIONS RESEARCH INSTITUTE, ZTE, CHINA JILIANG UNIVERSITY,…

Fan-Out Wafer Level Packaging Patent Landscape

…Nytell Software, Oerlikon, PacTech Packaging Technologies, Philips, Polaris Innovations (WiLAN), Powertech Technology, Princo Middle East FZE, Qimonda, Qualcomm, Renesas Electronics, Samsung Electronics, Samsung Electro Mechanics, Semiconductor Components Industries, Seoul National…

RF Front-End Modules for Cellphones Patent Landscape

…LG Innotek, Samsung Electronics, Mediatek, Sony, RFaxis, Huawei, Renesas, Samsung Electro Mechanics, Motorola, ZTE, NXP, LG Electronics, Foxconn, Nec, Hitachi, Sony Ericsson Mobile Communications, Panasonic, Infineon Technologies, Texas Instruments, Analog…

GaN Technology Top-100 IP Profiles

…in GaN field. Companies mentioned in the report ADVANCED OPTOELECTRONIC TECHNOLOGY, ADVANCED POWER DEVICE RESEARCH ASSOCIATION, APPLIED MATERIALS, AVOGY, CANON, CEA, CHONBUK NATIONAL UNIVERSITY, CREE, DOWA ELECTRONICS MATERIALS, ELECTRONICS &…

TSV Stacked Memory Patent Landscape

…market with first products appearance (3DS DDR4, HBM, HMC) but also first hot patent litigations between ELM 3DS and microelectronics giants (Samsung Electronics, SK Hynix and Micron Technology). The TSV…