The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents

SOPHIA ANTIPOLIS, France – January 28, 2021 | The last decade has seen EV/HEV applications driving packaging innovation in power electronics and creating new equations to solve for module makers, in particular further downsizing, higher power density, higher reliability and lower cost/higher manufacturability. On top of that, automotive OEMs are asking for highly standardized power[…]