TSV Stacked Memory Patent Landscape

An emerging market with leading industrials and first patent litigations; Who owns what ? Publication September 2016 Download Flyer  Download Sample A FAST GROWING TSV MEMORY MARKET In the semiconductor industry, 3D integration using through-silicon via (TSV) has been considered to be a promising way for improving performance and density instead of conventional device scaling. By connecting Read more about TSV Stacked Memory Patent Landscape[…]